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Portable Bonding System

Mark A. Tuscano

May 8, 2017

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Portable Bonding System

  • Presented at Forum 73
  • 6 pages
  • SKU # : 73-2017-0149
  • Your Price : $30.00
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Portable Bonding System

Authors / Details: Mark A. Tuscano

Abstract
The current method used for bonding liners onto dynamic components requires the use of spring-loaded clamps, vacuum bags, and ovens. This process works well for our smaller articles although has posed problems for our larger bonding requirements. The primary problem for our large bonded components is our ovens would take up to 3.5 hrs. to heat the thickest areas up to bonding temperature. For the adhesives that we use the recommended temperature ramp-up time is 20-60 minutes. In addition, the thinner areas reach temperature sooner and would exceed the recommended maximum curing time of 60 min. A minimum of 25 pounds per square inch (PSI) is required to achieve a sound bondline. The clamps used during cure cycles rely on springs to apply pressure to the liner being bonded. The pressure they exert is not exact, and tends to vary. A vacuum bag can only apply the pressure that is supplied by shop air, 14.7 psi. The solution to achieving uniform and accurate pressure during bonding operations is to have a flexible zoned system that can bring all the areas, thick and thin, to temperature simultaneously, apply even amounts of pressure to the liners, and record all zones of temperature and pressure during the bonding process. Through the entire process, the zones are monitored, recorded, and graphed. This system can be moved anywhere within the factory because the heating elements and the air bladders are incorporated into the fixture.

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